Board Test Agilent Technologies, Fort Collins, Colorado USA September 12 - 14, 2004 Following the very successful 2nd Board Test Workshop (BTW) held at ITC 2003, the BTW Organizing Committee is organizing the third BTW event, which will be hosted by Agilent Technologies in Fort Collins, Colorado. BTW04 will focus on current issues and trends related to board test. Similar to BTW 2003, perspectives are invited from contract manufacturers, test equipment providers, researchers, end users and systems providers. BTW04 is sponsored by the IEEE Computer Society - Test Technology Technical Council (TTTC) and supported by the Board Test Action Group (BTAG).

Topics Traditional Board Test Techniques Boundary Scan-based test techniques Assessing BSDL compliance and accuracy Board test: structural versus functional test Parametric testing OnBoard Built-In Self Test techniques Electrical, Optical and X-Ray board test mix Board test for high-volume consumer products Advances in flying probe technoilogy Creating board functional tests Advances in ICT fixturing Interfacing test flows with manufacturing flows Board test: linking ICT with low-cost PC testers Board test: fault-coverage metrics Board test: reducing false fails Applications of VXI/PXI plug and play technology In-System Configuration OnBoard programmability of CPLDs/FPGAs How to program PLDs to execute test functions New Standards and New Problems Practical use of P1581 SCITT Advances in 1149.6 AC-EXTEST Advances in 1149.4 Mixed-Signal test Bus Test techniques for SERDES boards Outsourcing to EMS companies Outsourcing to EMSs - issues and solutions Re-using prototype tests in volume manufacturing At-speed board and system structural test System-Level and Field-Service Test Using 1149.1 as a backplane test-bus 1149.1 backplane test-bus support devices Systems design integration and test issues Field servicing: test needs and solutions Board and System Test Economics Board test economics Emulation in a field-service environment Board test: educational requirements

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